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DISCRETE SEMICONDUCTORS
DATA SHEET
M3D370
BZA109TS 9-fold ESD Transient Suppressor
Preliminary specification File under Discrete Semiconductors, SC01 1997 Sep 08
Philips Semiconductors
Preliminary specification
9-fold ESD Transient Suppressor
FEATURES * ESD rating > 8 kV, according to IEC1000-4-2 * SOT339 surface mount package * Common anode configuration * Non-clamping range 0 - 6.8 V, negative clamping range <0.5 V, positive clamping range >6.8 V. APPLICATIONS * Computer and peripherals * Audio and video equipment * Communication systems * Medical equipment. PINNING SOT339-1 DESCRIPTION
BZA109TS
Monolithic silicon zener diode in a SOT339-1 package (SO20) for 9 bit wide undershoot/overshoot clamping, combined with fast ESD transient suppression.
book, halfpage
20
11
1 Top view
10
MBK198
Fig.1 Symbol and pinning.
Fig.2 Simplified outline.
1997 Sep 08
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Philips Semiconductors
Preliminary specification
9-fold ESD Transient Suppressor
LIMITING VALUES (per diode) In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL IZ IF IFT IFSM IZSM Ptot Tstg Tj PARAMETER reverse current forward current feed-through current peak forward current peak reverse current total power dissipation storage temperature junction temperature CONDITIONS DC; Tamb = 25 C DC; Tamb = 25 C DC; Tamb = 25 C; note 1 tp = 1 ms; square wave tp = 1 ms; square wave Tamb = 25 C; note 2 - -65 -65 MIN. - - - -
BZA109TS
MAX. 20 100 100 4.5 2.5 0.95 +150 +150
UNIT mA mA mA A A W C C
THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient; note 2 VALUE 135 UNIT K/W
Note to the Limiting values and Thermal characteristics 1. Current is flowing from input to corresponding output. 2. One or more diodes loaded. ELECTRICAL CHARACTERISTICS (per diode) Tj = 25 C unless otherwise specified. SYMBOL VZ VF VZSM IH RZ SZ CD PARAMETER reverse voltage forward voltage reverse surge voltage input high current zener impedance temperature coefficient of VZ input diode capacitance f = 1 MHz; VR = 0 f = 1 MHz; VR = 5.25 V CONDITIONS IZ = 250 A IF = 100 mA tp = 1 ms; IZSM = 2.5 A VIN = 5.25 V IZ = 250 A MIN. 6.4 - - - - - - - TYP. 6.8 - - - - 3 - - MAX. 7.2 1.1 10 0.5 100 - 200 100 UNIT V V V A mV/K pF pF
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Philips Semiconductors
Preliminary specification
9-fold ESD Transient Suppressor
BZA109TS
10 IZSM (A) Ptot (W)
2
1.5
1
0.5
1 0.1 1 tp (ms) 10
0 0 50 100 150 TS (C) 200
All diodes loaded.
Fig.3
Maximum non-repetitive peak reverse current as a function of the pulse time.
Fig.4
Power derating curve.
100 P ZSM (W)
150 CD (pF)
100
10
50
1 0.1 1 tp (ms) 10
0 0 1 2 3 4 5 VZ (V) 6
PZSM = VZSM x IZSM; VZSM is the non-repetitive peak reverse voltage at IZSM.
Fig.5
Maximum non-repetitive peak reverse power dissipation as a function of the pulse duration (square pulse).
Tj = 25 C; f = 1 MHz.
Fig.6
Diode capacitance as a function of the working voltage; typical values.
1997 Sep 08
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Philips Semiconductors
Preliminary specification
9-fold ESD Transient Suppressor
GRAPHICAL DATA
BZA109TS
IEC 1000-4-2 network CZ = 150 pF; R Z = 330
Note 1: attenuator is only used for open socket high voltage measurements
Vertical Scale = 100 V/Div Horizontal Scale = 50 ns/Div
Vertical Scale = 10 V/Div Horizontal Scale = 50 ns/Div
output GND
GND GND
input
Unclamped +1 kV ESD Voltage Waveform (IEC1000-4-2 network)
Clamped +1 kV ESD Voltage Waveform (IEC1000-4-2 network)
GND
Vertical Scale = 10 V/Div Horizontal Scale = 50 ns/Div
GND input
Vertical Scale = 100 V/Div Horizontal Scale = 50 ns/Div
GND output
Unclamped -1 kV ESD Voltage Waveform (IEC1000-4-2 network)
Clamped -1 kV ESD Voltage Waveform (IEC1000-4-2 network)
Fig.7
ESD clamping test set-up and waveforms.
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Philips Semiconductors
Preliminary specification
9-fold ESD Transient Suppressor
TYPICAL COMMON ANODE APPLICATION
BZA109TS
A nine-fold transient suppressor in a SOT339 package gives the possibility to protect nine separate lines using only one package. Two simplified examples are illustrated below.
Fig.8 Computer interface protection.
Fig.9 Microprocessor protection.
1997 Sep 08
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Philips Semiconductors
Preliminary specification
9-fold ESD Transient Suppressor
DEVICE PLACEMENT AND PRINTED-CIRCUIT BOARD LAYOUT
BZA109TS
Circuit board layout is of extreme importance in the suppression of transients. The clamping voltage of the BZA109TS is determined by the peak transient current and the rate of rise of that current (di/dt). Since parasitic inductances can further add to the clamping voltage (V = L di/dt) the printed-circuit board layout should use minimal series conductor lengths. This includes the lead length of the suppression element. In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended: 1. Place the suppression element in the area of the input terminals or connectors. 2. Reduce parallel signal paths. 3. Avoid running protection conductors in parallel with unprotected conductors. 4. Minimize all printed-circuit board loop areas including power and ground loops. 5. Minimize the length of the transient return path to ground. 6. Avoid using shared transient return paths to a common ground point.
1997 Sep 08
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Philips Semiconductors
Preliminary specification
9-fold ESD Transient Suppressor
PACKAGE OUTLINE
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
BZA109TS
SOT339-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 pin 1 index A1 (A 3) Lp L 1 e bp 10 wM detail X A
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.0 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 7.4 7.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 0.9 0.5 8 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT339-1 REFERENCES IEC JEDEC MO-150AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-09-08 95-02-04
1997 Sep 08
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Philips Semiconductors
Preliminary specification
9-fold ESD Transient Suppressor
DEFINITIONS Data Sheet Status Objective specification Preliminary specification Product specification Limiting values
BZA109TS
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1997 Sep 08
9
Philips Semiconductors
Preliminary specification
9-fold ESD Transient Suppressor
NOTES
BZA109TS
1997 Sep 08
10
Philips Semiconductors
Preliminary specification
9-fold ESD Transient Suppressor
NOTES
BZA109TS
1997 Sep 08
11
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
117027/00/01/pp12
Date of release: 1997 Sep 08
Document order number:
9397 750 02834

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